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With automatic optical inspection, defects in production can be detected with the help of highly modern systems and innovative image processing methods.
Function test
A function test involves the precise analysis and testing of the electronic assembly with regard to its functionality as well as its functional requirements.
In-Circuit Test (ICT)
With the in-circuit test, the assemblies are placed on specially developed test adapters and a component-level test is performed.
Climate test
When performing a climate test, the electronic assemblies are exposed to different climatic conditions and subsequently checked for damage or changes.
X-ray of the assemblies
With the help of high-resolution X-ray systems, we are able to check printed circuit boards or individual components for their quality, durability and functionality and, if necessary, develop proposed solutions.
Flying Probe Test
The Flying Probe Test (FPT) is an electronic test procedure which basically uses the in-circuit measurement method. Here, the test specimen is not contacted via a needle bed, but "flying" via freely movable needles. Higher testing times are offset by greater flexibility and lower initial costs. Especially at the beginning of a product's life cycle, the FPT test allows the required programmes to be quickly and flexibly adapted to changing layouts.
Temperature change test (TCT)
With the help of the temperature change test, it is possible to find out what effects and material changes a frequent change in temperature will have in the later area of use.
Burn-in test
The burn-in test makes it possible to find components in advance that would not withstand continuous operation and thus lead to the overall failure of the assembly. This test is a useful addition to the electrical tests carried out earlier.
Boundary scan
The boundary scan method uses additional cells that allow specific signals to be injected externally into the electronic assembly under test via predefined paths.