Separation – Separation of assemblies from the manufacturing panel

Often, several electronic assemblies are already summarized in the production as so-called panels to allow better assembly. In order to be able to carry out a subsequent separation problem-free and stress-free, we offer you the following separation methods:

Depaneling with milling device

Depaneling is often used on products that place high demands on the quality of the separation process – also in terms of performance and flexibility. In addition, the assemblies are exposed to only a very low stress during the separation process. The high separation accuracy offers another advantage. However, the structure of this mechanism is much more complex than at other methods.

Depaneling with wedge cutter

If the panels are to be separated by means of a wedge cutter, they are placed in a suitable separating device and separated by means of two cutters located above and below the component. A previously introduced V-groove in the circuit board serves as a guide. The advantage of this method is in particular the low stress exerted on the assembly. However, a prior introduction of a V-groove in the circuit board is also required here and there is only a small flexibility with regard to the different PCB variants.

Depaneling with rotary blade

In this type of depaneling, the panels are placed in a special separation device and separated using sharp rotary blades. The previously introduced V-groove in the circuit board serves as a guide for the rotary blade. The advantage of this method lies especially in the simple structure of the mechanism. However, this methodology is partially less accurate than other methods and therefore can not be applied equally to each product.

We are happy to advise you on the advantages and disadvantages of the different separation processes and develop an individual concept that is completely adapted to the requirements and needs of your product.