Separation of assemblies from production panels

For better and more effective assembly in production, several electronic assemblies are combined in the production stage as panels.
In order to be able to carry out subsequent separation without problems and stress, we offer you the following separation procedures:


De-panelling with a milling machine

The de-panelling process with the aid of milling machines is often used for products that place high quality demands on the de-panelling process - including with regard to performance and flexibility. The assemblies are also subjected to very little stress during the separation process. The high separation accuracy offers another advantage. However, the design of this mechanism is much more complex than other methods.

De-panelling with a wedge blade

If the panels are to be separated from each other using a wedge blade, they are placed in a corresponding separating device and separated using two wedge-shaped blades located above and below the component. The upper blade is lowered and the lower blade is fixed. A V-groove made previously in the printed circuit board serves as a guide. The advantages of this method are the manageable investment costs and the very small amount of stress that can be applied to the assembly during the process.

De-panelling with a roller blade

With this type of panel separation, the panels are placed in a special separating device and separated from each other with the help of sharp roller blades. A V-groove created previously in the printed circuit board serves as a guide for the roller blade. The advantage of this method lies particularly in the simple design of the mechanics.